1.HPL material system
After the pressing of HPL and HPL-Compact, any protruding material is removed. The edges are cut to the correct length and width in double-ended profilers by sawing or routing. Single-sided HPL is sanded on the reverse side to improve bonding on a substrate (e. g. chipboard). After checking the dimensions and the surface for contamination and defects, the HPL is packed for shipping.