3.Machining and processing HPL

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3.6.3Pressing temperature

The safest pressing temperature for stress-free composite boards is 20 °C. High- er temperatures allow a reduction of pressing time. However, 60 °C should not be exceeded because the dimensional changes of the HPL in contrast to the substrate depend on temperature. This avoids increased stress which leads to warping and changes in the surface. The manufacturer's information has to be observed.

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