3.7.12Stationary forming and bonding curved shapes in a single step

Stationary forming and bonding curves in a single step corresponds to the method described above. The only difference is that instead of the mould, the substrate – a chipboard with the desiredcurve – is used. First, the HPL is bonded to the flat surface of the substrate. For this, the HPL has to protrude over the substrate with the required width. The remaining area of the substrate and – depending on the adhesive type – the protruding HPL area have to be coated with suitable adhesives.

Forming with heated bars (contact heat)
Forming HPL and bonding to the substrate are achieved with a flat, heated, movable bar under pressure. This forming bar heats the HPL to the required forming temperature using contact heat. Under constant pressure, this bar automatically follows the respective profile and connects the HPL to the workpiece. The speed for the motion sequence during the bending process can be adjusted and can be adapted to different surface materials. This allows the required forming temperature to be optimised to the forming process.