3.Machining and processing HPL
HPL up to a thickness of approx. 3 mm requires a substrate. The substrate has to meet different properties. In particular, it has to be rigid and has to have a smooth surface. This is an essential prerequisite for good visual appearance. The choice of a suitable adhesive, the amount of adhesive applied as well as the contact pressure and temperature for bonding also have considerable influence on the appearance and surface of the composite element. Like many other materials, HPL reacts to temperature and humidity fluctuations with dimensional changes.
These can be different to those of the substrates and the adhesives and have to be taken into account during processing.
The following table lists some materials as examples of what can be used as substrates:
Table 5: Substrate materials, material types and subgroups
| Material type | Subgroups |
|---|---|
| Chip-based wood boards | Chipboard |
| Fiber-based wood board | Fibreboard (MDF, HDF) |
| Veneer-based wood boards | Plywood |
| Laminated veneer lumber (LVL) | |
| Combined wood boards | Blockboard |
| Honeycomb sheets | Paper, metal and plastic honeycomb |
| Foamed plastic boards | Different polymers |
| Mineral substrates | Plasterboard, gypsum fibre, vermiculite, calcium silicate, fibre cement, cement-bonded chipboard |
| Full-size metal boards | Metal types |
Special panel types, e. g. with higher resistance to humidity or flames, are used for special applications. In individual cases they may require special processing conditions. It is therefore recommended to consult the panel manufacturers.
The following aspects additionally have to be taken into account:
Composite elements made of HPL and mineral substrates have a wide field of application and are often mandatory where increased requirements for reaction to fire have to be met, e.g. for high-rise buildings, ship building or public transport.