3.Machining and processing HPL

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3.6.1Bonding processes

Both sides of the HPL and the substrate must be thoroughly cleaned immediately before bonding so that it’s free from any release agents, particles and rough debris which could show on the surface after bonding. Grease and oil stains can be removed using suitable solvents – do not use nitrocellulose thinner (observe accident prevention regulations!).

As a rule, test bonding is recommended under the local conditions. The safety regulations must be observed for working with adhesives, solvents and hardeners.

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